As photonic and electronic devices began to converge, bandwidth, efficiency, and functionality improved significantly. On the flip side, testing and packaging these silicon photonic (SiP) devices has proven to be a challenge. Testing conventional microcircuits can be done through physical contact, conventional positioning control devices, and visual inspection. On the other hand, photonic devices require non-contact and nanoscale alignment between the hybrid device under test and a probe fiber or other element. And we haven’t even begun discussing the complications involved in packaging such devices.