OPTICAL COMPONENTS, COATINGS, & MATERIALS INSIGHTS

optodiode aerospace How Optical Components Improve Performance In Aerospace And Defense Sensing Systems

What does it actually take to keep optical systems performing in space? The answers may surprise even experienced engineers.

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  • Why Facet Preparation Matters Before PIC Packaging And Optical Coupling

    As PICs, waveguides, and fiber arrays move toward scalable applications, post-dicing facet preparation can play a critical role in optical coupling, insertion loss, repeatability, and downstream packaging success.

  • Loose Fiber Bundle Loading, Polishing & Inspection Workflow

    See how KrellTech’s loose fiber bundle workflow supports repeatable handling from preparation and loading through polishing and inspection. The process is designed for controlled endface processing and efficient inspection, with the flexibility to inspect in-line or offline without re-referencing before additional polishing.

  • Fiber Optic Connector Repair With In-Line Inspection

    See how KrellTech demonstrates fiber optic connector repair using an FC/UPC connector, combining controlled polishing with in-line inspection while the component remains fixtured. This workflow helps reduce handling between steps, speed endface evaluation, and support repeatable connector repair, process development, and lab work across a range of connector styles.

  • Fiber Array Unit Polishing Workflow On NOVA

    See how KrellTech demonstrates a complete FAU polishing workflow on the NOVA™ system, from carrier loading and programmable processing to material removal tracking, cleaning, and final inspection for repeatable photonic component polishing.

  • Large Diameter Bare Fiber Polishing With In-Line Inspection

    See how KrellTech’s SpecPro™ Polishing System supports stable, repeatable polishing of large diameter bare fibers for laser and source applications. Using our LD/cannula workholder and SpecVision™ video scope, this process combines polishing and in-line inspection in one system to help reduce handling, support endface quality, and improve workflow efficiency.