Latest Headlines

  1. Kaohsiung Partners With The 'Valley Of Optics' As NSYSU Advances AI Silicon Photonic Chips 5/18/2026

    As artificial intelligence and cloud computing continue to surge, the global technology industry is confronting a new challenge: confronting the rocket-growing data transmission challenge, the transmission bandwidth obviously becomes the bottleneck.

  2. Creating And Controlling Light, All In One Quantum Material 5/14/2026

    In a new paper published in Nature Communications, a research team led by Columbia physicist James McIver revealed that a quantum material called tungsten ditelluride (WTe2) can both create and control ultrafast light signals.

  3. Spacerake Inc. And Rajant Corporation Sign MOU To Explore Multidomain Lasercom Integration With Kinetic Mesh Networks 5/14/2026

    SpaceRake Inc., a developer of multi-domain laser communications network capabilities, today announced a Memorandum of Understanding (MOU) with Rajant Corporation, the pioneer of Kinetic Mesh wireless networking, to explore how lasercom technology can extend and complement existing radio infrastructure in demanding operational environments.

  4. Near-Invisible Ultrathin Solar Cells That Could Turn Windows Into Power Generators 5/14/2026

    Imagine a car whose windows and sunroof can help top up its battery while parked under the sun, or a pair of smart glasses whose lenses can harvest light to power built-in electronics.

  5. POET Technologies And Lumilens Advance Wafer-Level Photonic Integration For Next-Generation AI Optical Networks 5/14/2026

    POET Technologies Inc. ("POET" or the "Company") (NASDAQ: POET), a leader in highly integrated optical engines and light sources for AI networks, and Lumilens Inc. ("Lumilens"), an emerging leader in high-performance scale-up and scale-out optical interconnects for AI workloads, today announced they have entered into a supply agreement that establishes a strategic joint development and commercial technology partnership to advance a new class of wafer-level photonic integration for frontier AI infrastructure.

  6. Forge Nano Delivers Semiconductor Wafer Fab Equipment To Leading Fortune Global 500 Communications Company For Commercial Photonics Applications 5/14/2026

    Forge Nano, Inc., a leading U.S. based semiconductor equipment and advanced materials company pioneering Atomic Layer Deposition (“ALD”) technology for artificial intelligence (“AI”)-era chip manufacturing and defense battery applications, which has signed an agreement to merge with Archimedes Tech SPAC Partners II Co. (“Archimedes II”) (NASDAQ: ATII), today announced the delivery of its TEPHRA™ semiconductor wafer fabrication tool to a leading Fortune Global 500 communications infrastructure company for advanced photonics applications.

  7. IMDEA Networks Participates In The Development Of The Photonic Chip Of The Future 5/13/2026

    IMDEA Networks is already working on the development of photonic integration technologies that will revolutionize the next generations of communications within the framework of the PIXEurope project.

  8. 'Isotropic Shrinkage Of Patterned Vacancies Enables 3D Nanoprecise Metastructures For Visible Light Applications' 5/13/2026

    Fujikura Ltd. (Director, President and CEO: Naoki Okada) has been conducting joint research on "three-dimensional nanofabrication technology" with researchers from the Department of Mechanical Engineering, Biological Engineering, and the McGovern Institute at the Massachusetts Institute of Technology (MIT) in the United States.

  9. IonQ, World's Leading Quantum Platform Company, Opens New Quantum Computing R&D Lab In Boulder 5/12/2026

    IonQ today announced a new laboratory suite in Boulder, Colorado that will house state-of-the-art Quantum Computing R&D and semiconductor chip testing facilities that will be used to develop and refine technologies central to future generations of its leading quantum computing systems.

  10. Modular Photonics Alignment System For Fiber-Optics Applications With Higher Loads 5/12/2026

    Physik Instrumente (PI), a global leader in precision motion control and nanopositioning systems, introduces the F-572 High-Performance 3- to 6-Axis Photonics Alignment System, designed for high-throughput active alignment applications in photonics manufacturing and test.