Autonomous mobility’s progress has been achieved in fits and starts, though the past few years have seen accelerated development in its enabling technologies.
Siemens announces recently a partnership with BRIDG to drive the development of Digital Twin technologies for the semiconductor industry by providing Siemens’ PLM software portfolio to enable BRIDG’s research and development activities.
Photons with energy higher than the 'band gap' of the semiconductor absorbing them give rise to what are known as hot electrons.
Apple recently announced the latest award from its $1B Advanced Manufacturing Fund. Finisar, a leading manufacturer of optical communications components, will receive $390M as part of Apple’s commitment to support innovation and job creation by American manufacturers.
Scientists at Ben-Gurion University of the Negev (BGU) are proposing a new method to obscure an optical chip by bending light around the object. This could be achieved by manipulating waves in the near field region (such as surface plasmons) of a metamaterial surface (a metasurface) on an integrated photonic structure.
Layered two-dimensional materials that are as efficient, but thinner than, silicon semiconductors, could power future electronic circuits and devices, according to Stanford researchers.
Flexible hybrid electronics (FHE) is a category of microelectronics using novel materials with stretchable, conformable, and flexible form factors. FHE enables wearables, medical Internet of Things (IoT) applications, defense applications, and more by shifting from electronics based on rigid and fragile circuit boards to flexible electronics components mounted on substrates, such as plastics and textiles.