Current Headlines

  1. NLM Photonics Initiates Sampling of 1.6T And 3.2T Silicon Organic Hybrid PICs 3/4/2026

    NLM Photonics heads to OFC 2026, from March 17-19, to showcase its 1.6T and 3.2T silicon-organic hybrid (SOH) photonic integrated circuits (PICs), which are now sampling to select customers.

  2. New Method Produces Quantum Dots That Offer Advantages For Light-Based Technologies 3/4/2026

    Light-based quantum technologies, such as quantum communication and photonic quantum computing, require reliable sources of individual photons and, ideally, pairs of entangled photons. Semiconductor quantum dots are promising candidates for this purpose.

  3. Trapping Light On Thermal Photodetectors Shatters Speed Records 3/4/2026

    Electrical engineers at Duke University have demonstrated the fastest pyroelectric photodetector to date that works by absorbing heat generated by incoming light.

  4. Tower Semiconductor To Participate At OFC 2026 Highlighting Its Silicon Photonics Platform For AI, Telecom And Emerging Applications 3/4/2026

    Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221.

  5. TransnetBW Implements Prisma Photonics' To Evaluate AI-Driven Dynamic Line Rating Technology On Three Power Circuits 3/4/2026

    Prisma Photonics, a pioneer in grid monitoring technology using advanced optical fiber sensing, today announced an evaluation program in partnership with TransnetBW GmbH, one of Germany's four transmission system operators, to deploy and operationalize its PrismaPower™ line monitoring technology across 120 kilometers of transmission lines in southwest Germany.

  6. PG&O® Celebrates 41 years In Precision Optics Industry 3/3/2026

    Precision Glass & Optics marks 40+ years delivering high-precision optics, coatings, and infrared solutions, expanding capabilities with new polishing and cutting equipment to support advanced aerospace, medical, and industrial applications.

  7. Aehr Receives Follow-On Order For Fully Automated Wafer-Level Burn-In Systems Powering AI Optical I/O And Data Center Interconnects 3/3/2026

    Aehr Test Systems, a leading provider of test and burn-in solutions for semiconductor devices used in artificial intelligence (AI), data center, automotive, and industrial applications, today announced it has received a follow-on purchase order from its lead silicon photonics customer for production wafer-level test and burn-in of silicon photonics integrated circuits used in data center optical interconnects and emerging optical I/O architectures for AI processors.

  8. VIAVI To Showcase Breakthrough AI Fabric And Optical Test Advances At OFC 2026 3/3/2026

    VIAVI Solutions Inc. (VIAVI) (NASDAQ: VIAV) will showcase advanced technologies for the validation of next generation AI fabrics at scale at Optical Fiber Communication (OFC) 2026 from March 17-19 at the Los Angeles Convention Center.

  9. Piezo Flexure Stages For Nanometer-Precision Positioning In Photonics, Semiconductor, And Life Science Applications 3/3/2026

    Physik Instrumente (PI), a global leader in nanopositioning and precision motion control, provides a large portfolio of piezo flexure stages engineered for ultra-precise positioning in demanding industrial and research environments.

  10. Semtech Expands Data Center Portfolio With Acquisition Of HieFo Corporation 3/3/2026

    Semtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.