Xenics Articles

  1. Sensor-Based Food Inspection And Sorting
    5/16/2019

    Food inspection based on sensors for the visual, shortwave infrared, UV and X-ray realms in connection with automated sorting and classification methods has become a major field of application for advanced image capture systems and infrared cameras such as those made by Xenics. This case study tells how Xenics' line scan SWIR camera Lynx is used for copmlex imaging tasks.

  2. Improving Vision With Shortwave Infrared Line Scan Cameras
    5/2/2019

    With better performance and lower cost, shortwave infrared line scan cameras are proving their worth in a variety of machine vision systems, from inspecting and sorting food to detecting cracks inside solar cells.

  3. SWIR Multiplexing: Temporal Multiplexing For Cost-Effective Multispectral Solutions
    6/19/2018

    Temporal multiplexing is an alternative approach to hyperspectral imaging that uses a fast LED technology. Instead of illuminating broadband an splitting the spectrum of light in the camera, a broadband sensitive chip is used, and the illumination spectrum is varied over time via fast triggering.

  4. Carbon Nanotubes – Applications And Luminescence-Based Imaging With SWIR Cameras
    6/8/2018

    This white paper covers the use and benefits of SWNTs in a wide range of applications. Examples are offered on how cooled scientific SWIR InGaAs cameras are used to enable innovative technologies for luminescence-based imaging of nanotubes.

  5. Xenics And Ophir-Spiricon Partner For Laser Beam Profiling Applications That Require InGaAs Cameras
    5/7/2018

    This application note discusses how Xenics’ InGaAs camera type Xeva 1.7 320 was used to detect very low power images from either a direct source or a beam reflected off an image plane, as was needed in this application.

  6. Thermal Lock-In Inspection Of Semiconductor Devices
    4/17/2018

    Thermal imaging cameras can be utilized as powerful tools for semiconductor failure analysis. This application note discusses the value and effectiveness of using thermal lock-in when conducting semiconductor inspections.

  7. Creating A Passive Laser Beam Analyzer Through A Haas Laser Technologies And Xenics Partnership
    10/13/2017

    High power CO2 lasers produce a beam of infrared light with wavelengths centering typically at 9.3 or 10.6 μm. Haas Laser Technologies, Inc. has developed a compact, all passive optical design laser beam analyzer for focused laser beams from a CO2 laser with wavelength range from 9.3 to 10.6 μm. In conjunction with a Fabry-Perot resonator and Xenics’ Gobi-640-GigE microbolometer camera, the new beam analyzer offers laser beam measurement and analysis for continuous-wave (CW) as well as pulsed lasers.

  8. Laser Beam Profiling And Infrared Cameras
    6/13/2017

    This white paper addresses the general need for laser beam profile analysis, describes laser beam analysis instruments, and provides an overview of laser applications, in particular for infrared wavelengths.

  9. Short-Wave Infrared Cameras In Semiconductor Inspection Applications
    4/13/2017

    This white paper discusses several applications of SWIR (short-wave infrared) cameras within semiconductor inspection applications, especially those that rely on the capability of SWIR cameras to see through semiconductor materials, such as silicon.

  10. Short-Wave Infrared Adaptive Optics And Applications
    2/23/2017

    This article introduces adaptive optics and the benefits of using (short-wave) infrared cameras in wavefront sensing for applications including astronomy, laser communication, biological imaging microcopy, and retinal imaging in combination with optical coherence tomography.