Thermal Lock-In Inspection Of Semiconductor Devices With Xenics XCO Camera Module

By Xenics

Thermal imaging cameras can be utilized as powerful tools for semiconductor failure analysis. However, conventional thermography or thermal imaging techniques used for semiconductor devices are faced with intensity variations caused by differences in emissivity of the various materials, and thermal hot spot dilation. This application note discusses the value and effectiveness of using thermal lock-in when conducting semiconductor inspections. Download the full paper for more information.