Latest Headlines

  1. Molecular Hybridization Through Vacuum 8/6/2025

    Interactions between atoms and molecules are facilitated by electromagnetic fields. The bigger the distance between the partners involved, the weaker these mutual interactions are.

  2. Alluxa Introduces Breakthrough ULTRA Low-Stress Dichroic Deposition Process For Thin Substrates 8/5/2025

    Alluxa’s new Sirrus™ PVD process delivers ultra-flat, low-stress dichroic filters on thin substrates, enhancing optical performance for microscopy, medical, and space applications without compromising steep edges or high transmission.

  3. New Method Instantly Characterizes Thousands Of Molecules 8/5/2025

    The new method, inspired by an imaging technique that has been around for 35 years, takes ultraprecise measurements of a molecule’s unique light-emission signature at the scale of a billionth of a second.

  4. Hamamatsu Photonics Accelerates Development Toward The Industrialization Of Quantum Computers 8/5/2025

    Hamamatsu Photonics has been selected for a project called "Development of Post 5G Information Communication Systems / Accelerating the Development of Quantum Computers toward Industrialization" as part of the "Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems" run by NEDO, Japan.

  5. 6-Axis Alignment System With High-Performance Direct Drive Mechanics And Ultra-Fast 'First Light' Algorithms, New From PI 8/5/2025

    PI (Physik Instrumente), a global leader in precision motion control and photonics alignment solutions, announces the release of the new F-690.S1 SpaceFAB 6-axis alignment platform, purpose-built for high-throughput photonics integrated circuit (PIC) packaging and test applications.

  6. Quantum Computing Inc. Awarded TFLN Photonic Chip Contract By U.S. Department Of Commerce's National Institute Of Standards And Technology 8/5/2025

    Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT), an innovative, integrated photonics and quantum optics technology company, today announced it has been awarded a contract by the National Institute of Standards and Technology (NIST), part of the U.S. Department of Commerce, for the design and fabrication of thin-film lithium niobate (TFLN) photonic integrated circuits (PICs).

  7. A Hybrid Photonic-Terahertz Chip For Communications And Sensing 8/4/2025

    Researchers at EPFL and Harvard University have engineered a chip that can convert between electromagnetic pulses in the terahertz and optical ranges on the same device.

  8. Lightium, MPI Corporation, And Axiomatic_AI Announce Strategic Partnership To Revolutionize Photonic Integrated Circuit (PIC) Device Testing With AI-Driven Solutions 8/4/2025

    Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.

  9. Photon Design's HAROLD Quantum Dot Laser Simulator Is A Release Candidate Available For Customer Evaluation 8/1/2025

    Photon Design, a global leader in photonic simulation CAD software, has announced that its quantum dot module for its HAROLD laser simulation tool, is now available as a release candidate for customer evaluation.

  10. 'This Type Of Computing Operation Can Make AI Applications More Trustworthy' 8/1/2025

    In his dissertation, Dr Frank Brückerhoff-Plückelmann developed photonic processors that can perform complex AI calculations energy-efficiently at the speed of light. He also designed a neural network that can self-assess the reliability of its predictions.