Latest Headlines

  1. IQE And Tower Semiconductor Announce Multi-Year InP epiwafer Supply Agreement 6/15/2026

    IQE plc (AIM: IQE, "IQE" or the "Group"), the leading global supplier of compound semiconductor wafer products and advanced material solutions, and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, are pleased to announce a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers for optical connectivity solutions serving AI-driven data centre infrastructure.

  2. PicoJool Introduces 200G VCSELs And MicroVCSELs For Scale Up AI Data Centers 6/15/2026

    PicoJool, a pioneer in optical connectivity, is introducing its 200G Vertical Cavity Surface Emitting Lasers (VCSEL) products with a bandwidth exceeding 37GHz. 

  3. ACON OPTICS (TWSE: 6820) Strengthens AI High-Speed Interconnect Portfolio With CPO And 1.6T Connectivity Technologies At COMPUTEX 2026 6/15/2026

    ACON OPTICS (TWSE: 6820), a leading provider of advanced optical connectivity solutions, showcased its latest innovations in AI optical interconnect technologies at COMPUTEX 2026 under the theme "Shaping Next-Generation Interconnect."

  4. How To Create Distinguishable States For Quantum Systems 6/15/2026

    Researchers around the world are racing to develop new quantum-based systems for sensing, communication, computing, and control that have the promise of outperforming traditional systems. Creating stable, measurable, distinguishable quantum states, which would be the heart of any such system, is a daunting task.

  5. NIS 150 Million Initiative Launched To Advance Israel's Next Generation Of Photonic Chips 6/14/2026

    The Israel Innovation Authority, in collaboration with the Directorate of Defense Research & Development (DDR&D/MAFAT) at the Ministry of Defense, has launched a new call for proposals to establish or provide an advanced research and development infrastructure in the field of integrated photonics.

  6. Snapshot 3D Image Projection Using Light Programming 6/13/2026

    Researchers at the UCLA Samueli School of Engineering and CNSI (California NanoSystems Institute), led by Professor Aydogan Ozcan, introduced a snapshot 3D image projection system that integrates a digital encoder with a passive diffractive optical decoder, jointly optimized end-to-end through deep learning.

  7. SEMI 3D & Systems Summit To Spotlight Heterogeneous Integration As Key To Europe's Semiconductor Future 6/12/2026

    The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration.

  8. Demonstration Project For Next-Generation Remote O&M Utilizing All-Photonics Network (APN)-IOWN - Advancing And Enhancing Sustainability Of Regional Plant Operations Through Advanced Communication Technologies 6/12/2026

    Chiyoda Corporation (Chiyoda) will participate in a demonstration project on next-generation remote Operation and Maintenance (O&M) utilizing All-Photonics Network (APN*1)-IOWN*2, jointly implemented with NTT EAST, Inc. (NTT EAST), Siemens AG (Siemens) and Emerson Japan Group (Emerson), as part of the 'Regional Society DX Promotion Package Project' led by the Ministry of Internal Affairs and Communications.

  9. Photon Design Adds Silicon Modulator Design Capability To Its HAROLD Laser Simulation Tool 6/11/2026

    Photon Design, a leader in photonic simulation CAD software, has added a silicon modulator design capability to its HAROLD semiconductor and laser simulation tool, across a range of geometries.

  10. QuiX Quantum Joins QuantumBW And Photonics BW To Strengthen The Photonic Quantum Ecosystem In Baden-Württemberg And Europe 6/11/2026

    QuiX Quantum is pleased to announce its membership in QuantumBW and Photonics BW, two leading Baden-Württemberg networks driving collaboration across quantum technologies, photonics, research, industry and technology transfer.