Latest Headlines

  1. CEA-Leti And NcodiN Partner To Industrialize 300 mm Silicon Photonics For Bandwidth-Hungry AI Interconnects 3/11/2026

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, today announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.

  2. Salience Labs Launches Industry's Highest Performing 32-Port All-Optical Silicon Photonic Switch To Transform The Networking Layer Of AI Datacenter Infrastructure 3/10/2026

    Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch.

  3. La Luce Cristallina Releases Beta Version Of 200-mm BaTiO₃ Wafer For Co-Packaged Optics And AI-Scale Photonics 3/10/2026

    La Luce Cristallina today announced that the beta version of its 200-mm (8-inch) barium titanate (BaTiO₃) wafer is now available to customers for evaluation in advanced electro-optic modulators for telecommunications and data communications applications.

  4. Photon Design Will Use OFC 2026 To Release Its HAROLD QD Laser Simulator And Launch Its Silicon Modulator Design Tool 3/10/2026

    Photon Design, a global leader in photonic simulation CAD software, will showcase its newly released HAROLD QD laser simulator and silicon modulator design tool, at the Optical Fiber Communication Conference and Exhibition (OFC 2026), 15–19 March 2026, Los Angeles, California, booth #1155.

  5. Sydney Researchers Build Ultra-Compact AI Chip Operating At Speed Of Light 3/10/2026

     The nano photonic chip prototype, which harnesses the power of light particles (photons) is built completely in-house at the Sydney Nano Hub at the University of Sydney.

  6. Ciena Solidifies AI Networking Leadership, Unveils New Innovations For High-Speed Connectivity 3/10/2026

    Ciena continues to strengthen its leadership in shaping the future of networking with new innovations designed to meet surging AI-driven bandwidth demands.

  7. Ciena Brings AI Networking Expertise To OFC 2026 3/10/2026

    At OFC 2026, taking place March 15-19 in Los Angeles, Ciena’s booth (#1927) will feature innovations that redefine what’s possible in modern networking across data center networks, quantum-safe communications, network automation, and AI operations (AIOps).

  8. STMicroelectronics Enters High-Volume Production Of Its Industry-Leading Silicon Photonics Platform To Support AI Infrastructure Demand 3/9/2026

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.

  9. Filtering Photons For Better Quantum Computers 3/6/2026

    Quantum computers often require hundreds of components for a single reliable qubit, making scaling up complicated and expensive.

  10. OpenLight Receives First Volume Production Orders For NewPhotonics 800G And 1.6T Laser-Integrated PICs With Tower Semiconductor PH18DA InP-On-Silicon Platform 3/5/2026

    OpenLight, a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs), today announced the first-ever volume production orders by a customer on its PH18DA indium phosphide (InP) on silicon photonic platform, developed in collaboration with Tower Semiconductor.