Latest Headlines

  1. New Origin To Collaborate With Imec To Scale Photonic IC Manufacturing In Industrial Environment 3/13/2026

    New Origin, a specialised pure-play Photonic ChipTech Foundry, will work closely with imec, a world-leading research and innovation organisation in advanced semiconductor technologies, to address the need to scale silicon nitride-based Photonic IC (PIC) manufacturing in an industrial environment.

  2. CIG And ML&S Group Form Joint Venture To Scale Global Manufacturing Of High-Speed Optical Modules And NPO Solutions 3/12/2026

    Cambridge Industries Group (CIG), a global leader in broadband technologies and high-speed optical transceivers, today announced a significant expansion of its long-standing collaboration with ML&S Group.

  3. Oriole Networks Announces PRISM Ultra: The One-Hop Photonic Network Fabric With 50 Exabit Per Second Throughput 3/12/2026

    Oriole today announced PRISM Ultra, the next major evolution of its pure photonic AI networking platform.

  4. Salience Labs And Keysight Collaborate To Develop First Optical Circuit Switch Testing Environment 3/12/2026

    Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, and Keysight Technologies, Inc. (NYSE: KEYS), today announced a strategic collaboration to develop the first optical circuit switch (OCS) testing environment.

  5. NewPhotonics® Introduces Industry First 3.2Tbps DR8 Transmitter-On-Chip PIC With Integrated OSPic™ Optical Signal Processor For AI Data Center Connectivity 3/12/2026

    NewPhotonics Ltd, today unveiled the industry first NPG10240 3.2Tbps PIC with 448Gbps modulators, integrated lasers and OSPic™ optical signal processor.

  6. HyperLight Introduces 145 GHz Reference Modulators To Enable 448Gbps Per Lane Datacom And 260GBaud Telecom Development 3/12/2026

    HyperLight Corporation, creator of the TFLN Chiplet platform, today announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio.

  7. Lightmatter Expands Photonic Interconnect Roadmap With Passage L20 Unified Optical Engine For NPO And OBO Applications 3/11/2026

    Lightmatter, the leader in photonic (super)computing, today announced the Passage L20, a 6.4 Tbps (each direction) optical engine (OE) designed to accelerate the AI data center transition to high-density optical interconnect for multi-rack scale-up and high-bandwidth scale-out. 

  8. Quantum Computing Inc. And Ciena Demonstrate Next-Generation Quantum-Secured Communications With High-Speed Encryption Using PQC And QKD At OFC 2026 3/11/2026

    Quantum Computing Inc. ("QCi" or the "Company") (Nasdaq: QUBT) an innovative, quantum optics and integrated photonics technology company, and Ciena (Nasdaq: CIEN) today announced a joint demonstration of next-generation quantum secure communications at OFC 2026 in the Corporate Village Booth #5355. 

  9. Scintil Releases DWDM Laser Source Evaluation Kit For Scale-Up AI Networks 3/11/2026

    As AI systems scale from single-rack scale up network systems to multi-rack configurations up to 1,000s of AI processors, copper interconnects have reached their limits in speed, density, and reach.

  10. HyperLight, UMC, and Wavetek Announce Strategic Partnership For High-Volume Foundry Production Of TFLN Chiplet Platform 3/11/2026

    HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet Platform on both 6-inch and 8-inch wafers.