ZYGO offers the new APM650™ packaging metrology system designed to provide 2D and 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. This inspection tool is ideal for the automated measurement of panel based PCBs and other advanced packaging applications.
The APM650™ system utilizes Coherence Scanning Interferometry (CSI) measurement technology. This technology offers the benefits of non-contact metrology, sub-nanometer measurement precision independent of field magnification, and the ability to measure a wide variety of surface types including polished, ground, structured, and stepped.
This packaging metrology system accommodates even the largest PCB substrate panels with metrology area dimensions up to 650 x 650 mm. The system’s integrated automation software enables hands-free metrology of multiple features all within a single workstation which reduces production time and increases process knowledge. Customized chucks and sample holders have been made available for adaption to smaller panels, or to singulated substrates for maximum application flexibility.
For more features, benefits, and measurement examples, visit the website or download the datasheet.