Datasheet | April 14, 2016

Packaging Metrology System: APM650™ Datasheet

The APM650™ packaging metrology system is designed to provide 2D and 3D measurements of a variety of surface features with sub-nanometer vertical precision and sub-micron lateral precision. This inspection tool is ideal for the automated measurement of panel based PCBs and other advanced packaging applications. For more features, benefits, and measurement examples, download the datasheet.

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