Business Wire

  1. Ciena Brings AI Networking Expertise To OFC 2026 3/10/2026

    At OFC 2026, taking place March 15-19 in Los Angeles, Ciena’s booth (#1927) will feature innovations that redefine what’s possible in modern networking across data center networks, quantum-safe communications, network automation, and AI operations (AIOps).

  2. Semtech Expands Data Center Portfolio With Acquisition Of HieFo Corporation 3/3/2026

    Semtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.

  3. NTT Unveils Technology To Enhance AI Performance For 6G And Next Generation Computing 3/2/2026

    Today, NTT, Inc. (NTT), NTT DOCOMO, Inc. (NTT DOCOMO), and NTT DATA Group Corporation announced that they will exhibit at MWC Barcelona 2026, the world's largest connectivity exhibition, in Barcelona, Spain, from March 2 to 5.

  4. IOWN Global Forum And Open Compute Project Join Forces To Deliver On The Next Wave Of AI 2/10/2026

    The Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), the international industry association developing next-generation, photonics-driven networks, and the Open Compute Project Foundation (OCP), the global non-profit organization bringing hyperscale innovations to all, today announce a cooperative framework, called the AI Computing Continuum, to deliver a seamless computational infrastructure from centralized to edge deployments.

  5. Marvell Completes Acquisition Of Celestial AI 2/2/2026

    Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced that it has completed its previously announced acquisition of Celestial AI, a pioneer in optical interconnect technology for scale-up connectivity.

  6. NTT, DOCOMO, And NTT DATA To Exhibit At MWC Barcelona 2026 1/28/2026

    The NTT Group, comprising NTT, Inc., NTT DOCOMO, INC., and NTT DATA Group Corporation, announced today that they will jointly exhibit at MWC Barcelona 2026, the world’s largest connectivity event, to be held in Barcelona, Spain, from March 2 to March 5, 2026.

  7. Lightmatter Introduces Guide Light Engine For AI, Featuring VLSP Technology 1/26/2026

    Lightmatter, the leader in photonic (super)computing, today announced a foundational advancement in laser architecture: Very Large Scale Photonics (VLSP).

  8. LightIC Technologies Announces New FMCW LiDAR With Exceptional Cost And Power-Efficiency For Automotive And Robotic Applications 1/26/2026

    LightIC Technologies (“LightIC”), a leading supplier of silicon photonics–based FMCW LiDAR, and indie, an automotive solutions innovator, today announced a strategic partnership and the completed reference design, integrating indie’s iND83301 System-on-Chip (SoC) into LightIC’s silicon photonic FMCW LiDAR architecture.

  9. FS Launches 1.6T OSFP IHS/Closed Finned Top Modules For The Next AI/HPC Network 12/22/2025

     FS, a trusted provider of ICT products and solutions, has unveiled its new 1.6T OSFP IHS (Closed Finned Top) optical transceivers, including the OSFP-DR8-1.6T and OSFP-2FR4-1.6T models for high‑density AI and HPC InfiniBand XDR networks.

  10. Infleqtion And Silicon Light Machines Partner To Boost Quantum Computer Performance 10/9/2025

    Infleqtion, a global leader in neutral atom-based quantum technology, today announced a strategic partnership with Silicon Light Machines, a micro-electro-mechanical systems (MEMS) innovator based in Silicon Valley.