Business Wire

1. Lumentum Demonstrates Industry-Leading Technologies And Products For Scale-Out, Scale-Up And Scale-Across AI Infrastructure At OFC 2026 3/17/2026

   Lumentum Holdings Inc. (“Lumentum”), a global leader in photonic solutions, today announced its showcase of technology and product demonstrations designed to meet the accelerating demands of next-generation AI and data center infrastructure at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles.

2. Teradyne Introduces Photon 100 3/17/2026

   Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.

3. HyperLight Introduces 400G-per-lane PICs On Its TFLN Chiplet Platform For Next-Generation AI Interconnects 3/17/2026

   HyperLight Corporation (“HyperLight”), creator of the TFLN Chiplet Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) designed for next-generation AI networking infrastructure.

4. Marvell And Lumentum To Demonstrate Optical Circuit Switching For Next-Generation AI Scale-Up Infrastructure 3/16/2026

   OFC 2026 - Marvell Technology, Inc.. a leader in data infrastructure semiconductor solutions and Lumentum Holdings Inc., a market-leading designer and manufacturer of optical and photonic products, today announced a live demonstration of Marvell optical connectivity solutions interoperating with Lumentum’s optical circuit switching (OCS) platform. 

5. CIG And ML&S Group Form Joint Venture To Scale Global Manufacturing Of High-Speed Optical Modules And NPO Solutions 3/12/2026

   Cambridge Industries Group (CIG), a global leader in broadband technologies and high-speed optical transceivers, today announced a significant expansion of its long-standing collaboration with ML&S Group.

6. Oriole Networks Announces PRISM Ultra: The One-Hop Photonic Network Fabric With 50 Exabit Per Second Throughput 3/12/2026

   Oriole today announced PRISM Ultra, the next major evolution of its pure photonic AI networking platform.

7. Salience Labs And Keysight Collaborate To Develop First Optical Circuit Switch Testing Environment 3/12/2026

   Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, and Keysight Technologies, Inc. (NYSE: KEYS), today announced a strategic collaboration to develop the first optical circuit switch (OCS) testing environment.

8. HyperLight Introduces 145 GHz Reference Modulators To Enable 448Gbps Per Lane Datacom And 260GBaud Telecom Development 3/12/2026

   HyperLight Corporation, creator of the TFLN Chiplet platform, today announced the release of its 145 GHz Packaged Intensity Modulator (IM), expanding the company‘s high-speed modulator portfolio.

9. Lightmatter Expands Photonic Interconnect Roadmap With Passage L20 Unified Optical Engine For NPO And OBO Applications 3/11/2026

   Lightmatter, the leader in photonic (super)computing, today announced the Passage L20, a 6.4 Tbps (each direction) optical engine (OE) designed to accelerate the AI data center transition to high-density optical interconnect for multi-rack scale-up and high-bandwidth scale-out. 

10. HyperLight, UMC, and Wavetek Announce Strategic Partnership For High-Volume Foundry Production Of TFLN Chiplet Platform 3/11/2026

    HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet Platform on both 6-inch and 8-inch wafers.