Business Wire

  1. Lightmatter Expands Photonic Interconnect Roadmap With Passage L20 Unified Optical Engine For NPO And OBO Applications 3/11/2026

    Lightmatter, the leader in photonic (super)computing, today announced the Passage L20, a 6.4 Tbps (each direction) optical engine (OE) designed to accelerate the AI data center transition to high-density optical interconnect for multi-rack scale-up and high-bandwidth scale-out. 

  2. HyperLight, UMC, and Wavetek Announce Strategic Partnership For High-Volume Foundry Production Of TFLN Chiplet Platform 3/11/2026

    HyperLight Corporation (“HyperLight”), United Microelectronics Corporation (“UMC”), and Wavetek Microelectronics Corporation (“Wavetek”), a wholly owned subsidiary of UMC, today announced a strategic manufacturing partnership for high-volume foundry production of HyperLight’s TFLN (thin-film lithium niobate) Chiplet Platform on both 6-inch and 8-inch wafers.

  3. Xscape Photonics Announces $37M In New Funding, Launches Eight-Wavelength Laser For AI Data Center Networks 3/11/2026

    Xscape Photonics (“the Company”), a semiconductor startup developing photonic solutions for next-generation AI data center fabrics, today announced $37M in additional funding, bringing the company’s total Series A funding to $81M.

  4. Salience Labs Launches Industry's Highest Performing 32-Port All-Optical Silicon Photonic Switch To Transform The Networking Layer Of AI Datacenter Infrastructure 3/10/2026

    Salience Labs Limited, a leader in photonic solutions targeting connectivity for AI datacenter infrastructure, today announced the availability of the industry’s highest performing all-optical 32-port switch.

  5. Ciena Solidifies AI Networking Leadership, Unveils New Innovations For High-Speed Connectivity 3/10/2026

    Ciena continues to strengthen its leadership in shaping the future of networking with new innovations designed to meet surging AI-driven bandwidth demands.

  6. Semtech Expands Data Center Portfolio With Acquisition Of HieFo Corporation 3/3/2026

    Semtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, today announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.

  7. NTT Unveils Technology To Enhance AI Performance For 6G And Next Generation Computing 3/2/2026

    Today, NTT, Inc. (NTT), NTT DOCOMO, Inc. (NTT DOCOMO), and NTT DATA Group Corporation announced that they will exhibit at MWC Barcelona 2026, the world's largest connectivity exhibition, in Barcelona, Spain, from March 2 to 5.

  8. IOWN Global Forum And Open Compute Project Join Forces To Deliver On The Next Wave Of AI 2/10/2026

    The Innovative Optical and Wireless Network Global Forum (IOWN Global Forum), the international industry association developing next-generation, photonics-driven networks, and the Open Compute Project Foundation (OCP), the global non-profit organization bringing hyperscale innovations to all, today announce a cooperative framework, called the AI Computing Continuum, to deliver a seamless computational infrastructure from centralized to edge deployments.

  9. Marvell Completes Acquisition Of Celestial AI 2/2/2026

    Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced that it has completed its previously announced acquisition of Celestial AI, a pioneer in optical interconnect technology for scale-up connectivity.

  10. NTT, DOCOMO, And NTT DATA To Exhibit At MWC Barcelona 2026 1/28/2026

    The NTT Group, comprising NTT, Inc., NTT DOCOMO, INC., and NTT DATA Group Corporation, announced today that they will jointly exhibit at MWC Barcelona 2026, the world’s largest connectivity event, to be held in Barcelona, Spain, from March 2 to March 5, 2026.