Article | June 20, 2019

The Future Is Now: How Glass Micro Bonding Enables A New Era Of Ultra-Reliable Wafer Level Chip Scale Packaging

Source: SCHOTT Electronic Packaging

By Ville Hevonkorpi and Antti Peltonen, SCHOTT Primoceler Oy

Innovative Glass Micro Bonding sealing technology is enabling unprecedented miniaturization and wireless signal transmission for medical implants, MEMS devices, and other electronic and optical devices.