The Future Is Now: How Glass Micro Bonding Enables A New Era Of Ultra-Reliable Wafer Level Chip Scale Packaging
Source: SCHOTT North America, Inc.
By Ville Hevonkorpi and Antti Peltonen, SCHOTT Primoceler Oy
Innovative Glass Micro Bonding sealing technology is enabling unprecedented miniaturization and wireless signal transmission for medical implants, MEMS devices, and other electronic and optical devices.
access the Article!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of Photonics Online? Subscribe today.
Subscribe to Photonics Online
X
Subscribe to Photonics Online
SCHOTT North America, Inc.
This website uses cookies to ensure you get the best experience on our website. Learn more