The Future Is Now: How Glass Micro Bonding Enables A New Era Of Ultra-Reliable Wafer Level Chip Scale Packaging
Source: SCHOTT North America, Inc.
By Ville Hevonkorpi and Antti Peltonen, SCHOTT Primoceler Oy
Innovative Glass Micro Bonding sealing technology is enabling unprecedented miniaturization and wireless signal transmission for medical implants, MEMS devices, and other electronic and optical devices.
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