SCHOTT Electronic Packaging offers the HermeS® glass substrate wafer with hermetically sealed solid “Through Glass Vias” (TGV) designed to enable fully gastight and long-term robust enclosures for MEMS devices such as industrial hermetic MEMS sensors, medical MEMS, and RF MEMS. It features fine-pitched vias that allow for reliable conduction of electrical signals and power into and out of MEMS devices.
The HermeS® glass substrate delivers excellent RF performance due to the low dielectric constant of glass and highly conductive via materials. The superior reliability of the packaging leads to long term performance, and higher mechanical, thermal, and chemical resistance of glass. Anodic bonding with Silicon is also available.
For additional information on the HermeS® glass wafer, download the datasheet.