Datasheet | January 9, 2018

HermeS® Hermetic Through Glass Via (TGV) Wafer Datasheet

Source: SCHOTT Electronic Packaging

The HermeS® Hermetic Through Glass Via (TGV) Wafer is a glass substrate designed to enable fully gastight and long-term robust enclosures for MEMS devices such as industrial hermetic MEMS sensors, medical MEMS, and RF MEMS. It features vine-pitched vias that allow for reliable conduction of electrical signals and power into and out of MEMS devices. For additional information on the HermeS® glass wafer, download the datasheet.