This application note provides information on the benefits of SWIR imaging in harsh or low-light level conditions, and PG&O's capabilities in manufacturing optical components for SWIR imaging.
Wichita State University’s National Institute for Aviation Research (NIAR) is using high-speed digital cameras, manufactured by Photron, in their Virtual Engineering Laboratory in a variety of testing modes such as high-impact dynamic events.
Radiometric temperature measurements are made with radiometric thermal cameras. This white paper discusses this non-contact, non-destructive technique (NDT) that offers advantages for many surface temperature measurement applications, as well as unmanned aerial systems (UAS).
In response to the need for recording 3D thermal images, a team at a university in Germany developed a thermal imaging/RGB system capable of delivering 3D imagery by overlapping pictures from four digital and four FLIR A65sc cameras with 25° fields of view.
The most significant development in the production of infrared sensors and their ability to affect improvements to SWaP-C requirements comes from the introduction of uncooled focal plane array (FPA) designs.
This case study discusses the use of the FASTCAM SA-Z to effectively slow down the turbulent flow of motion through the acquisition of a large number of images played back at various slow speeds for frame by frame data analysis.
This white paper describes how these sensor technology developments are able to provide pilots with immediate temperature, pressure, and oxygen concentration readings of fuel tanks in the duration of a flight.
Today’s products are designed to be manufactured in thousands or hundreds of thousands, and both parts and assembled products can be built and tested throughout the development process.
This application note describes the difference between cooled and uncooled thermal imaging cameras, and when to use them in applications such as industrial R&D, academics and research, and defense and aerospace.
Designers of digitally-assisted circuits are working towards unlocking the digital signal processing capabilities of fine line CMOS technology to leverage their digital processing potential for performance recovery or enhancement in systems. This case study highlights a key challenge associated with the design of these new types of circuits. It also describes the design and verification of a digitally-assisted ultrasound driver used for structural health monitoring as a non-destructive testing device.
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