Product/Service

Wafer Inspection System

Source: Veeco Instruments Inc.
The Wafer Substrate Flatness Inspection System improves process characterization of thin film head wafer substrates by providing single- or double-sided measurement of global and site flatness across 4.5-in. square wafer substrates
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The Wafer Substrate Flatness Inspection System improves process characterization of thin film head wafer substrates by providing single- or double-sided measurement of global and site flatness across 4.5-in. square wafer substrates.

Designed for thin-film head manufacturers, the fully automated WYKO SFT4500 determines global as well as user-definable local site flatness, such as Rz, Rt, slope, and radius curvature in a single measurement. The system is gauge capable for peak-to-valley tolerances as low as 2 µ.

The system includes built-in robotic handling and full SECS/GEM communications. Built for manufacturing environments, the system features an ergonomic design, software production interface, and operator safety shielding.

Veeco Process Metrology, 2650 East Elvira Rd., Tucson, AZ 85706. Phone: 520-741-1044; Fax: 520-294-1799.