Unique UV Laser Enables High-Speed IC Die Singulation

Santa Clara, CA - The new AVIA 355-23-250 from Coherent, Inc. offers the highest pulse repetition rate of any Q-switched ultraviolet laser, making it the optimum solution for high speed integrated circuit die singulation with high yields. Specifically, this new laser can deliver over 8 watts of 355 nm output at repetition rates of 250 kHz and higher. The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking.

The AVIA-355-23-250 is also unique in terms of output flexibility, making it the only laser that can provide output tailored for both scribing and dicing. Thanks to PulseEQ the laser can deliver low pulse energy at a 250 kHz repetition rate, which is ideal for gently scribing through the thin (typically 10 micron) epitaxial circuitry layers. Yet the same laser can also be operated at lower repetition rates, with pulse energies as high as 80 µJ, making it an optimum tool for dicing (cutting) through the wafer itself. Because of fully automated active optimization functions such as PulseEQ, ThermEQ and PosiLock, the pulse repetition rate and pulse energy can be rapidly changed with no effect on the laser's excellent beam quality (M² < 1.3), high pulse to pulse energy stability (noise < 5% rms at 70 kHz), and beam pointing.

The AVIA 355-23-250 is the ideal tool for high-throughput micromachining applications, such as scribing low-Κ semiconductors, dicing thin memory chips, and via hole drilling in printed circuit boards. Other applications include solar cell micromachining and direct patterning of thin films.

SOURCE: Coherent, Inc.