Thermal Electronics Inspection Reaching Defect-Free Designs

In order to save a considerable amount of time and finances, Xenics thermal cameras can detect heat defects in electronics before qualification. These cameras can also optimize a working instrument’s life cycle when used in critical control of heat dissipation. This application note describes how Gobi thermal imaging cameras can be used in PCB prototyping and repair, and in verifying thermal designs in power electronics motor drives. Download the application note for more information on Xenics’ Gobi Series and how it is used in various applications.