Datasheet | August 1, 2013

Silicon to Glass Bonding Wafer Substrate: SD-2 Datasheet

HOYA’s SD-2 glass substrate minimizes the distortion and bowing effects caused by a thermal mismatch between two wafers. This is ideal for applications involving semiconductors, pressure sensors, displacement sensors, and photolithography. For a detailed description, information on features, specifications and more, download the datasheet.

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