Video

PIC & Waveguides: Processing Considerations

Source: KrellTech

High-precision pick and waveguide processing demands far more than basic polishing capability. Consistent performance relies on repeatable component loading, accurate referencing, precise alignment, and tightly controlled polishing parameters—all while supporting a smooth transition from R&D to full-scale production.

At the foundation is fixture design. Chips must be loaded positively and repeatably, with well-toleranced holding mechanisms that preserve geometry and surface finish. Variations in die-cut quality, chip dimensions, and epoxy deposition can introduce non-uniform surfaces, making adjustable, non-damaging clamping essential. Fixtures must accommodate varying widths, lengths, and thicknesses, especially during early development phases, while avoiding sensitive waveguide regions through carefully selected materials and contact points.

Equally critical is fixture alignment and calibration. Accurate orientation of the chip relative to the polishing surface ensures uniform material removal and precise end-face geometry. Advanced systems move beyond passive alignment, using independent suspension mechanisms and Z-axis control to maintain consistent pressure and contact.

Polishing and process control further define success. Control over pressure, rotational speed, and cycle time—adjustable in real time for development and programmable for manufacturing—enables optimized material removal. Incremental, micron-level sample advancement prevents damage and over-polishing in sensitive regions, while supporting a wide range of materials and multi-step polishing processes.

Integrated video monitoring and inline inspection allow real-time visual feedback, geometry confirmation, and repolishing without unloading or re-referencing the chip. This minimizes handling, reduces contamination risk, and improves throughput.

Finally, scalability is key. Configurable fixtures, multi-position polishing, and flexible software platforms enable seamless progression from low-volume R&D to production. Systems like NOVA address these challenges holistically, delivering a future-ready platform for precision photonic component processing.

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