Physical Vapor Deposition – Sputtering vs. Electron Beam Evaporation
Source: Abrisa Technologies
Physical Vapor Deposition (PVD) is a family of processes that is used to deposit layers of atoms or molecules from the vapor phase onto a solid substrate in a vacuum chamber. Two very common types of processes used are Sputtering and Electron Beam Evaporation, which are described in this article.
access the Article!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of Photonics Online? Subscribe today.
Subscribe to Photonics Online
X
Subscribe to Photonics Online
Abrisa Technologies
This website uses cookies to ensure you get the best experience on our website. Learn more