Article | October 17, 2019

Physical Vapor Deposition – Sputtering vs. Electron Beam Evaporation

Source: Abrisa Technologies

By Ace Perez

Physical Vapor Deposition (PVD) is a family of processes that is used to deposit layers of atoms or molecules from the vapor phase onto a solid substrate in a vacuum chamber. Two very common types of processes used are Sputtering and Electron Beam Evaporation, which are described in this article.