High Bandwidth Access Selects Teradyne Test Systems; Catalyst Tiger and J750 to Test Highest Value, Most Integrated FIFO Queuing Devices on The Market Today
"Our FlexQ(TM) products are the communications industry's most advanced FIFO queuing devices used for high capacity broadband networks," said Eddie Chang, chief operating officer of High Bandwidth Access, Inc. "To fully test the high-performance, highly integrated and complex features designed into our chips, we needed high level test solutions. Teradyne gives us confidence that their test solutions will offer both the memory test capabilities and the best test economics for our FIFO family of devices. Teradyne's demonstrated expertise in testing this class of devices allows us to guarantee our customers that every unit of product we ship will meet their expectations."
Based on an innovative architecture and ASIC approach, HBA provides the industry's highest bandwidth (up to 14Gbps) on 3.3V interface devices for today's commonly used communication FIFOs. HBA's feature rich products offer the most cost effective, highest performance queuing, switching and traffic management solutions. HBA's FlexQ family is a direct socket replacement/ improvement for current communication FIFO Queuing devices. These 3.3V interface devices operate at the industry's fastest rate (up to 166Mhz), enabling applications to achieve 10 Gigabit /sec rates for OC-192 optical networking applications.
"Continually reducing costs while constantly improving quality and reliability is a must for success in the high-speed broadband networking market. HBA has already set a new industry standard for FIFO Queuing devices and is committed to delivering the highest value products to the market," said Der-Kant Cheng, president of High Bandwidth Access, Inc. "Teradyne's test platforms deliver speed, performance and configuration flexibility which enable us to test our evolving and increasingly complex devices. We also needed to work with a company that has extensive RF experience and a solid reputation for customer service. Teradyne's leading industry position in all these areas fulfilled our requirements," concluded Cheng.
Mike Bradley, president of Teradyne's Semiconductor Test Division, said, "Teradyne's test systems cover the largest range of ICs which has helped us win key design-ins with the leading fabless, foundry and subcontractor companies worldwide. We believe that our wide-ranging test solutions, coupled with the experience and global support for fabless semiconductor customers, will only strengthen HBA's leadership role in the queuing device market."
About J750 Family of Test Systems
The J750 delivers up to 1,024 digital channels in a zero footprint system entirely contained within a test head. Its high-throughput parallel testing capabilities help deliver 95% parallel test efficiency for up to 32 devices. The system offers a suite of options to address the variation of testing needs in the low-end and mid-range semiconductor markets, including the Converter Test Option, Memory Test Option, Mixed-Signal Option, Scan Test Option, RFID Option, Redundancy Analysis and APMU. Its small footprint and high parallel test throughput provide the most economical approach to testing complex VLSI devices with embedded memory and analog cells.
The system also features IG-XL test software, the semiconductor ATE industry's first test development suite combining the power and performance of the latest PC technology and Windows NT operating system with the familiarity of standard Windows productivity tools, like Microsoft Excel and Visual Basic.
About Catalyst Tiger
Catalyst Tiger is the first over 1 Gbps SOC test system. Extending the Catalyst family, Tiger shares the same high throughput zero-time DSP architecture, IMAGE(TM) software, and state-of-the-art analog instruments and extends the Catalyst family to 1024 digital pins. Powered by breakthrough Silicon Germanium (SiGe) technology, Tiger sets the standard with Real I/O(TM) data rates to 1.6 Gbps while retaining the timing flexibility at top speed demanded by data and network processing applications.
About HBA
High Bandwidth Access, Inc. (HBA) is a fabless communications semiconductor company providing the industry's most advanced FIFO queuing and traffic management devices used for high capacity broadband networks. Based on an innovative architecture and ASIC approach, HBA's initial FlexQ(TM) family is the industry's highest bandwidth communications FIFO queuing device on 3.3 interfaces. HBA products also provide the highest density (up to 5MB), lowest cost, and most advanced features in their category. In the future, this architecture will enable Intelligent Queuing for more advanced traffic management functions and even greater performance levels. HBA has partnered with the industry leaders United Microelectronics Corporation (NYSE: UMC) for semiconductor manufacturing and ASE Test Limited (Nasdaq: ASTSF ) for IC packaging and test, ensuring customers of high quality, high capacity, just-in-time delivery, and access to the latest technology.
HBA is located in San Jose, California with offices in Hsinchu, Taiwan and Penang, Malaysia. For more information about HBA, visit the Company's website at http://www.hba.com
About Teradyne
Teradyne (NYSE: TER) is the world's largest supplier of automatic test equipment and is also a leading supplier of high performance interconnection systems. Teradyne's test products are used by manufacturers of semiconductors, circuit assemblies, voice and broadband telephone networks. Teradyne's backplane assemblies and high-density connectors are used by manufacturers of communications and computing systems central to building networking infrastructure. The company had sales of $3.0 billion in 2000 and currently employs about 9000 people worldwide. For more information visit www.teradyne.com.
IMAGE is a trademark of Teradyne, Inc. FlexQ is a trademark of High Bandwidth Access, Inc.