SCHOTT Electronic Packaging and Primoceler Oy have joined forces to expand current hermetic packaging portfolios with pioneering glass micro bonding technology. This process enables the manufacture of vacuum-tight, ultra-miniature electronic and optical devices with superior reliability. This bonding method is based on laser technology and can be completed without any heat or added materials.
Typical applications and key benefits of glass micro bonding:
The use of SCHOTT Primoceler‘s Glass Micro Bonding enables the use of glass in implants and offers truly reliable hermetic sealing, high biocompatibility, and RF transparency enabling wireless data and power transfer for implanted devices.
As key instruments in IoT devices and networks, MEMS components offer high precision performance, hermetic bonding and no additives for extreme miniaturization, long-term reliability, and minimized outgassing.
SCHOTT Primoceler‘s Glass Micro Bonding can help manufacture high-end flow cell devices to support countless applications in cell and gene manipulation. Key benefits include no additives for a perfect gap control between layers and undisrupted results, and high bonding strength for greater pressure and faster processes.
The glass micro bonding technology delivers high hermeticity, and reliable all-in-glass packages for devices to withstand the harshest aerospace environments with the highest stability possible.
Since high temperature applications are challenging to work in, SCHOTT Primoceler Oy bonding offers only one material in packaging and no additives for avoiding CTE issues and outgassing.
Improvements in Ultra-Thin Glass (UTG) availability have made glass an ideal option when low profiles are required in micro-optics applications. No glues or other added materials means thinner components, and lower heat yields a higher UTG.
Visit the SCHOTT EP web page for more information.