DuPont Microcircuit Materials Introduces New DuPont Solamet Photovoltaic Metallization Pastes For Local Back Surface Field Solar Cell Designs
Solamet PV36x Series for Local BSF Enables Up to 0.8 Percent Greater Solar Cell Efficiency
DuPont Microcircuit Materials (MCM) has introduced a new series of aluminum photovoltaic metallization pastes for rear side passivated crystalline silicon solar cell designs. DuPont Solamet PV36x photovoltaic metallization pastes outperform conventional aluminum compositions by delivering up to 0.8 percent greater conversion efficiency for solar cells when used in Local Back Surface Field (BSF) designs. By continuing to bring Solamet photovoltaic metallizations to market that raise the bar for greater efficiency, and customizing materials specifically for new cell architectures such as Metal Wrap Through and Local BSF designs, DuPont continues to accelerate the drive toward grid parity in the solar industry.
"Revolutionary cell designs such as Local BSF need highly specialized metallization pastes designed to deliver efficiency gains and perform well in processing," said Peter Brenner, global marketing manager, photovoltaics – DuPont Microcircuit Materials. "Solamet PV36x combines DuPont science, advanced metallization paste technology and industry experience, with the creativity of our customers developing new cell designs, and it's a powerful combination. The quality of these collaborations is taking efficiency to the next level and promises high gains for the industry on a cost per watt basis."
Current commercial aluminum pastes designed for conventional cells have poor adhesion to passivation layers used with Local BSF designs, typically SiOx and/or SiNx, unless they contain some glass frit, and if the aluminum paste contains glass frit, voids can form at the edge of the aluminum-silicon contact area. DuPont Solamet PV36x photovoltaic metallization pastes overcome this challenge, while enabling up to 0.8 percent greater efficiency with these types of designs. They are developed to maximize adhesion and minimize voids, with controlled local alloying combined with high lateral conductivity.
Two new products are being introduced as part of the series. DuPont Solamet PV361 is designed for laser fired local contact formation. DuPont Solamet PV362 is optimized for Local BSF contact formation under conventional firing conditions. Both products are compatible with the latest Solamet tabbing silver pastes and new DuPont Solamet PV701 photovoltaic metallization for Metal Wrap Through designs.
DuPont Microcircuit Materials has over 40 years of experience in the development, manufacture, sale, and support of specialized thick film compositions for a wide variety of electronic applications in the photovoltaic, display, automotive, biomedical, industrial, military, and telecommunications markets. For more information on DuPont Microcircuit Materials and Solamet metallization pastes, please visit http://mcm.dupont.com.
DuPont Solamet photovoltaic metallizations are part of a broad and growing portfolio of products represented by DuPont Photovoltaic Solutions (DPVS), which connects science and technology from across the company on a global scale to help support the dramatic growth in the photovoltaic industry. For more information, visit http://photovoltaics.dupont.com.
About DuPont
DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 90 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation. For more information, visit www.dupont.com
SOURCE: DuPont Microcircuit Materials