First Sensor’s X7 series of photodiodes come in ultra-flat chip-scale packages and have been optimized for scintillator luminescence detection in the VIS range. The surface of the device is bond-wire free to allow for precision mounting of a scintillation crystal.
One of the more notable features of the X7 photodiode series is that its ultra-flat chip-scale package (CSP) is almost the same size as the semiconductor die. The chip is illuminated from the backside because it’s mounted on the carrier with the active area and electrical contacts facing down. This setup is what enables the previously mentioned scintillation crystal mounting. Additionally, multiple X7 photodiode elements can be assembled to create a larger linear or matrix array.
These photodiodes are ideal for integration into container scanners, cargo scanners, baggage screeners, and other contact-free and non-destructive inspection and security systems. For more information on the series or to request a quote, contact First Sensor.