DALSA Image Sensor Contracts Highlight Strength In Semiconductor Division

DALSA Corporation announced recently that it has received major contracts totaling CDN $5.8 million to deliver high resolution image sensor chips to two valued customers in the X-ray imaging and photogrammetry fields over the next two years.

"These new contracts clearly highlight the strength we have in our core operations, particularly in our Semiconductor division," commented Savvas Chamberlain, CEO of DALSA Corporation. "Across the board, we are seeing an increase in the demand for our high performance image sensor chips. Our OEM customers think in the long term and therefore value our significant R&D investment and strong product roadmaps. They also appreciate the security of supply that we provide through our specialized manufacturing capabilities. I am confident that this combination will allow us to further expand our leadership position moving forward in growing fields such as life sciences and professional imaging."

For the first contract, the image sensor chips will be "the eyes" of the customer's digital x-ray system, which is currently gaining broad market acceptance as an increasing number of hospitals and clinics worldwide make the investment in digital tools with the goal of more efficiently and accurately diagnosing and treating patients. In x-ray imaging, digital systems not only offer better imaging performance than film, but they also allow for lower radiation doses and improved patient comfort.

The second customer will use DALSA's high resolution chips in their large format photogrammetry camera system, which is designed to capture highly detailed imagery. Photogrammetry is the science of using aerial photographs and other remote sensing imagery to obtain accurate measurements of natural and human-made features on the earth. DALSA's image sensors chips are among the highest resolution, highest image quality products available for this application.

SOURCE: DALSA Corporation