Chemical Mechanical Polishing (CMP): The Enabling Technology

By Bob Roberts, AXUS Technology

Chemical Mechanical Polishing (CMP), used for the planarization of thin films on semiconductor circuitry, can be described as the enabling technology for all digital instruments. This article discusses the importance of this technology within the manufacture of advanced circuits and digital devices, provides a brief history on the technology, and walks through its challenges, characteristics, and real world applications. Download the full paper for more information.