With the increased use of MEMS devices, characterization of their motion is becoming essential, both to evaluate their performance and to develop process improvement strategies. The addition of integrated functionality within MEMS devices, such as the incorporation of thin piezoelectric layers, is leading to novel devices that require detailed measurement and characterization, in environmental conditions representative
of the operational state of the device. Additionally, manufacturing processes may lead to changes in residual stresses, which can result in degradation of device performance, representing further measurement challenges. There is a pressing need for a methodology to assess the performance of these functional materials at such miniaturized sizes.