Canon Introduces the First 0.65 NA DUV Stepper for 150nm Lithography

SANTA CLARA, CALIF. (April 4) BUSINESS WIRE -April 4, 1999--Canon's Semiconductor Equipment Division today announced a new high-throughput KrF stepper targeting the 150nm design rule. The FPA-3000EX6, the first deep-UV stepper with an ultra-low aberration NA 0.65 lens, can expose 117 wafers (200mm-dia.) per hour.

Canon said it is introducing the advanced step-and-repeat system to provide a lower-cost, high-performance DUV stepper option for chip makers who want to pursue aggressive device shrinks, but do not require the larger field size of step-and-scan tools. "The EX6 is the industry's first stepper to offer lithographic performance equivalent to the best scanners," says Phillip Ware, assistant general manager and director of technical marketing of Canon USA Semiconductor Equipment Division.

"The EX6 provides a simple, cost effective way of extending an existing 200mm fab down to the 150nm technology node," Mr. Ware said. "It allows our customers stay with 5X reticles and continue to generate profits with their current 200mm asset base for several more device generations."

With the introduction of the FPA-3000EX6, Canon customers have two leading-edge options for high-NA, 248nm DUV lithography, according to Mr. Ware. The announcement coincides with the recent volume shipments of Canon's 300mm-capable FPA-5000ES2 scanners.

The FPA-3000EX6 features the first stepper lens that is specifically designed for use with Canon's new IDEAL resolution enhancement technique. IDEAL multilevel imaging is Canon's new method for achieving a process k1 factor of 0.3 with ordinary optical lithography tools. Using IDEAL, the EX6 can image circuit features below 120nm with good process latitude. While IDEAL enables optical lithography to resolve circuit patterns smaller than one-half the wavelength of the illumination light, it also requires a lens with an extremely low wavefront aberration.

Mr. Ware said the design value for residual wavefront aberration in the FPA-3000EX6 lenses has been reduced by a factor of four, compared with earlier DUV steppers lenses. He said that aberration reduction is just one of several major reengineering initiatives Canon launched in its Utsunomiya factory in 1997. This initiative includes Zernike coefficient-based lens tuning, and Canon's high precision ULTiMA lens measurement process, which became part of its lens production line in early 1996.

While the FPA-3000 EX6 is built on the field-proven 3000 Series platform to maintain optimum mix-and-match compatibility with existing steppers in Canon's lineup, it also features many improvements to enhance overlay and throughput. Because of the potential for IDEAL to push its resolution below 120nm, Canon has incorporated the same high efficiency linear motor active damper vibration isolation technology found in its advanced 5000 Series 200mm/300mm capable scanner platform to enhance stability and overlay accuracy in the EX6.

The precision, repeatability and speed of Canon's FLAT wafer stage has also been dramatically upgraded through improved linear motors, tighter component tolerances and new assembly procedures. In addition, new batch streaming software now maximizes EX6 throughput for any lot size. The EX6 achieves throughput rates of 117 WPH on 200mm wafers-the highest in its class. "We've applied our reengineering program across the board with the EX6," Mr. Ware said.

Canon will exhibit the FPA-3000EX6 at SEMICON/Europa'99 in Munich, Germany, April 13-15, 1999. It is receiving orders for the new stepper and is scheduling deliveries beginning in September 1999. The unit price is about $7 million, but varies according to specifications. Canon expects to sell 100 FPA-3000EX6's within the first year of introduction.

FPA-3000EX6 Specifications

Reduction Ratio          5:1 

NA                       0.50-0.65 (automatic variable) 

Resolution               0.15-micron 

Exposure Field           22mm x 22mm 

Exposure Wavelength      248nm 

Light Source             KrF excimer laser 

Wafer Size               200mm maximum 

Reticle Size             6-inch square, 0.25-inch thickness 

Overlay Accuracy         Less than 30nm 

Throughput               117 WPH (200mmwafer) 

Notes to editors:

Canon's Semiconductor Production Equipment Group, in Utsunomiya, Japan, is part of the company's Optical Products Operations. The Semiconductor Equipment Division of Canon U.S.A., Inc., based in Santa Clara, Calif., supplies step-and-repeat and step-and-scan photolithography tools for manufacturing integrated circuits and large active matrix liquid crystal flat panel displays. Its 300mm-capable step-and-scan systems include the high NA (0.68) FPA-5000ES2 (KrF) and the FPA-5000AS1 (ArF).

Canon U.S.A., Inc., headquartered in Lake Success, N.Y., is an industry leader in professional and consumer imaging, and is a top patent-holder in imaging technology. It employs 12,000 people at more than 30 facilities throughout North, Central and South America and the Caribbean.

Canon, Inc., comprising all Canon Group operations, is a $24-billion company with 78,000 employees. Its headquarters are in Tokyo, Japan, with approximately 80 sales companies, manufacturing companies and R&D centers, worldwide.

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CONTACT: Canon U.S.A., Inc.

              Semiconductor Equipment Division 
              Phillip Ware or Yuan Zhang 
              972-409-7800 
              FOR PRESS ASSISTANCE: 
              Bill Keck, Bozell Kamstra 
              580-233-2496  Fax 580-233-2587 
              wjkeck@enid.com 

KEYWORD: CALIFORNIA

INDUSTRY KEYWORD: COMED COMPUTERS/ELECTRONICS

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