APEX®: Glass for Photonic and Optoelectronic Packages
3D Glass Solutions provides systems integration solutions for a wide array of Optoelectronic and Opto-RF products, ranging from mechanical spacers, fiber optic alignment trenches, to completely integrated optoelectronic packages.
APEX® Glass based Optoelectronic and Opto-RF packages offer higher degrees of systems integration than traditional glass substrates and legacy packaging materials, such as silicon, laminates, and ceramics.
These advantages include:
- Significantly reduced systems production costs
- Reduce package height by more than 70%
- Reduce package chip size by more than 50%
- Trench width and depth tolerances as small as 0.5 microns
- The complete integration of fiber optic trenches, cavities, and through glass vias for I/Os and electrical redistribution.
- Integration of vertical turning mirrors for chip-to chip and fiber-to chip communications
- Integration of optical waveguides and lenses
End User Applications
- Mechanical spacers
- Single-mode and multi-mode fiber optic alignment chips
- Fiber-to-Chip Optoelectronics
- Chip-to-chip Optoelectronics