Product/Service

Ultra Compact SMD Photodiode Package: AD230-8 SMD

Source: First Sensor AG

Ultra Compact SMD Photodiode Package: AD230-8 SMD

First Sensor presents a new ultra compact flat no-leads package (QFN, ODFN) for its APDs and PIN photodiodes. The plastic encapsulated reflow solderable SMD package features a footprint of only 4 mm² and very good resistance to moisture (MSL3). Applications include laser distance meters, rangefinders, LIDAR, high speed photometry, optical fiber communication, and more.

Important features of the new ultra compact SMD package:

  • Plastic encapsulated flat no-leads package (QFN, ODFN)
  • Very small housing with a footprint of only 4 mm²
  • Very good resistance to moisture (MSL3)
  • Available on tape and reel for high volume applications

For more information on the AD230-8 SMD photodiode package, contact First Sensor.

For more information on First Sensor's line of detectors, click here.