By Arron Campi, Acousto-Optic Product Manager
When designing micromaterial processing equipment, manufacturers need to consider a complex interplay of numerous factors, such as extremely accurate positioning of lasers for cutting, drilling, scribing, or for marking at the highest rate possible. In many integrated circuits, the required beam accuracies can be staggering. For example, processing equipment must be able to drill microvias and scribe trenches less than 10 μm in size. Display manufacturers must also accurately place and repair pixel circuitry at ever shrinking resolutions on increasing larger substrates. This requires advance tooling to avoid significant increases in processing time and costs. Download this article to learn about the ever changing beam steering techniques for micro-material processing.