Finding and fixing hot spots within ever-shrinking electronic systems has become more and more difficult. This webinar examines close-up and microscopic lenses and how they allow infrared cameras to make accurate temperature measurements on components less than 25 µm in size and image targets as small as 3.5 µm.
As electronic circuit boards and components get smaller and more powerful, inherent heating becomes a concern. Infrared camera technology is helping save electronic design companies money through improved test times and better product design.
Common tools for noncontact temperature measurements include both thermal imaging cameras and spot pyrometers. Each works by detecting infrared radiation and translating it into temperature readings. Thermal cameras, however, have several advantages compared to spot pyrometers, including image generation, temperature readings of each pixel of the entire image, and temperature readings from a longer distance.
Shortwave infrared (SWIR) cameras are sensitive to shorter IR wavelengths between visible light and 3 µm. They've historically been used for qualitative imaging applications such as laser beam profiling, silicon wafer inspection, and imaging through layers of paint and ink. Now, with the addition of temperature measurement capabilities, SWIR cameras offer a win-win for anyone concerned with thermal analysis of high-temperature materials or processes.
Recent advances in IR camera technologies, such as fast camera detector readouts and high-performance electronics, allow high-speed imagery. This article is part five of a handbook that discusses the use of ultra-high-speed thermography with IR cameras.