Product/Service

Specialized Coating Processes

Source: Deposition Sciences, Inc. (DSI)

DSI provides three specialized coating process technologies designed to accommodate the many demands placed on thin film coatings. Each process offers the ability to provide unique solutions, higher performance, increased volume, and much more durable coatings.

MicroDyn® Reactive Sputtering

MicroDyn® is a highly flexible, short-throw reactive sputtering process that is capable of depositing metals, metal oxides, nitrides, and mixed materials with fixed or graded compositions, ITO , and semiconductor materials. Used for both contact masking and photolithography, these coatings are capable of withstanding the thermal shock of direct transition from liquid nitrogen to boiling water, and can operate at temperatures as high as 1000°C.
 

Isodyn™ Low Pressure Chemical Vapor Deposition (LPCVD)

DSI’s LPCVD process is a thermally driven organo-metallic process configured for depositing multi-layers of silicon dioxide, tantalum oxide, and titanium dioxide. Able to process at high temperatures up to 500°C, this process offers extremely conformal and seamless coatings on many types of substrates such as glass, ceramics, or metals. The LPCVD process is unique in the capability to uniformly coat all surfaces with a high quality multi-layer optical coating.

Evaporative Coating

DSI provides evaporative coating chambers for complex infrared coatings. Advanced thin-film designs are deposited in precision, cryo-pumped vacuum chambers using electron beam guns and resistance sources with the option of ion assist. Infrared coatings with spectral performance requirements out to 25 microns in wavelength can be produced, while metals, metal oxides, dielectrics and semiconductors are deposited on various substrates. These coatings can be laser and nuclear hardened, have minimal scatter and absorption, are space-qualified, and meet all applicable military specifications.

For more information regarding DSI’s specialized processes, visit the website.