Application Note

Silicon Wafer Alignment With SWIR Cameras

Source: Raptor Photonics Limited

Since InGaAs cameras are sensitive from 900 nm to 1800 nm in the Short Wave Infra-Red (SWIR) range, they are very valuable when monitoring wafer bonding. In the SWIR spectrum, pure silicon is transparent at room temperature, while heavily doped silicon becomes more and more opaque as the temperature increases over 200°C. Imaging wafer plates using modern SWIR technology allows for extremely precise alignment due to high sensitivity, speed, and ease of use. Download the full application note for more on how the OW1.7-CL-320 and OW1.7-CL-640 are ideal solutions for silicon wafer alignment and monitoring.