OLS3000IR Laser Confocal Microscope Named Top Quality Assurance Product By Advanced Packaging Magazine

Olympus Micro-Imaging's new laser confocal technology has been honored as top Quality Assurance/Management Tool by Advanced Packaging magazine during its Sixth Annual Advanced Packaging Awards ceremony on July 12th in San Francisco. The award, given to Olympus' LEXT OLS3000-IR laser scanning microscope, was made during a presentation in San Francisco's Museum of Modern Art as part of SEMICON West 2006, the country's largest semiconductor industry trade show.

Present to accept the award for Olympus Micro-Imaging were Mr. Akimasa Wakabayashi, Division Manager, Olympus Tokyo; Joel Young, VP Sales/Marketing; and David Rideout, LEXT Product Manager. Called the LEXT-IR, this new near-infrared laser scanning confocal technology is designed for nondestructive interior observation of silicon wafers, IC chips, MEMS and various other semiconductor devices.

"Quality Assurance is so important to advanced packages, that when the Olympus LEXT OLS-3000IR was chosen by our judges as the best tool for this category, we saw the fit right away," commented Gail Flower, Editor-in-Chief of Advanced Packaging magazine. "A near-IR laser-based confocal microscope for non-destructive interior observation is just what is needed for the growing MEMS market and for examination of small features on bare die for wafer-level packages. We're proud to present Olympus with the APA award as the top choice in Quality Assurance/Management Tools category."

The new technology, introduced in the OLS3000 LEXT-IR micro-imaging system, features sub-micron imaging with outstanding 0.55 µm resolution and accurate three-dimensional measurement capability. Magnification power from 120x to 12,960x is ideal for nondestructive observation through the silicon package. Because the LEXT microscope uses a laser for pinpoint surface profile measurements, it offers resolution much higher than conventional near-IR imaging systems.

SOURCE: Olympus America Inc.