Model Based Analysis: A New Way To Measure Thin Films
Source: Zygo Corporation
By Eric Felkel, Zygo Corporation
Measuring the surface topology and thickness of thin films is important for characterizing many devices, but it can be difficult to resolve small enough features while covering a wide area. A new technique, model based analysis, creates a 3D map of both the film’s surface and thickness.
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Zygo Corporation
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