| |
Description of Business |
Technology Development |
| 1976 |
|
|
| 1978 |
|
|
| 1980 |
|
|
| 1981 |
|
|
| 1983 |
|
|
| 1984 |
|
|
| 1985 |
|
-
CDV (chemical vapor deposition) thin-film
formation technology using ECR plasma
-
Fabrications process for CMOS LSIs
-
Fabrication of ultra-high-speed bipolar LSIs (SST
process)
|
| 1986 |
|
|
| 1987 |
|
-
SC optical fiber connector technology
-
Multilayer board fabrication with copper/polyimide
interconnection
-
Design technology for 16QAW digital microwave
equipment
|
| 1988 |
|
|
| 1989 |
|
|
| 1990 |
|
|
| 1991 |
|
|
| 1992 |
|
|
| 1993 |
|
-
Hi-PAS packaging technology
-
Disital wireless circuit design technology
-
MU optical fiber connector technology
-
SIMOX basic technology
-
Fabrications process for 0.8µm Bipolar-CMOS LSI
|
| 1994 |
|
|
| 1995 |
|
-
Passive Double Ster method technology
-
LSI design technology for personal handyphone
systems
-
SIMOX board fabrication and quality evaluation
technology
-
Low-voltage LSI technology
-
Intelligent hub technology
- Automated optical fiber interferometer system
|
| 1996 |
|
|
| 1997 |
|
|
| 1998 |
|
-
www server software for financial systems
- Return loss measuring interferometer
- Temperature distribution measuring equipment for printed board
-
Subscribers' wireless network design technology
-
Technology for manufacturing plyimide optical
waveguides
|
| 1999 |
|
|
| 2000 |
|
-
2mm grid cable connector
- Electromagnetic environment design systems
- Optical fiber connector intermateability test program
- Disclosure support system for proceedings and images of local
assembly
|
| 2001 |
|
|
| 2002 |
|
|
| 2003 |
|
|
| 2004 |
|
|
| 2005 |
|
|