High Performance Submounts & Optoelectronic Circuits
Source: REMTEC
Remtec manufactures high performance metallized laser/photo diodes submounts, optoelectronics circuits, and spacers to customer specification
Remtec manufactures high performance metallized laser/photo diodes submounts, optoelectronics circuits, and spacers to customer specification. Remtec's submounts are produced on AlN and BeO. For less thermally demanding applications, alumina base material is available. Ceramic surface finish can be held to less than 2 µm with a "knife edge" angle.
Remtec's PCTF® (Plated Copper on Thick-Film) metallization with edge-wraps and plugged vias is well suited to provide costs effective solutions for laser/photo diode submounts and optoelectronics circuits. PCTF technology combines elements of thick and thin films with plated copper and nickel/gold finish. Remtec offers a range of customer driven metallization schemes with excellent and reliable adhesion.
Plated Copper on Thick Film for Power Applications
Ceramic Substrate Options
- 280 W/mK Thermal Conductivity - Beryllium Oxide
- 170 W/mK Thermal Conductivity - Aluminum Nitride
- 25 W/mK Thermal Conductivity - Aluminum Oxide
Metallization Options
- PCTF with plated copper (25-50 µm) for high power applications
- Selective copper and gold plating
- Various Wrap-Arounds (castellations, plugged vias, side metallization)
- Four-sided metallization is available
- Plating Finish: Ni/Au
- Suitable for Au/Sn soldering
- Wire bondable, solderable and weldable
- Thick-film metallization available: Au, Pt/Au, Pt-Pd-Ag
Remtec and its team of technical experts are ready to assist you with your metalized ceramics requirements.
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