Fast Optical Alignment For SiP Production

Within converging photonics and semiconductor technologies, many of the practical challenges in testing and packaging have not been addressed. Testing and packaging of silicon photonics elements require nanoscale alignments that cannot be performed using visual or mechanical references. This blog article presents PI’s solution that addresses the need for fast, parallel, nanoscale-accurate, multi-DOF global optical alignment optimization required in key SiP production steps from planar testing to packaging.