Chemical Mechanical Polishing (CMP): The Enabling Technology
By Bob Roberts, AXUS Technology
Chemical Mechanical Polishing (CMP), used for the planarization of thin films on semiconductor circuitry, can be described as the enabling technology for all digital instruments. This article discusses the importance of this technology within the manufacture of advanced circuits and digital devices, provides a brief history on the technology, and walks through its challenges, characteristics, and real world applications. Download the full paper for more information.
access the Article!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of Photonics Online? Subscribe today.
Subscribe to Photonics Online
X
Subscribe to Photonics Online
This website uses cookies to ensure you get the best experience on our website. Learn more